hdbls101g - hdbls107g creat by art - ideal for automated placement - reliable low cost construction utilizing molded plastic technique - high surge current capability - ul recognized file # e-326854 - halogen-free according to iec 61249-2-21 molding compound, ul flammability classification rating 94v-0 part no. with suffix "h" means aec-q101 qualified packing code with suffix "g" means green compound (halogen-free) terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 2 whisker test v rrm 50 100 200 400 600 800 1000 v v rms 35 70 140 280 420 560 700 v v dc 50 100 200 400 600 800 1000 v i f(av) a i 2 t a 2 s t rr ns t j c t stg c document number: ds_d1310040 version: f15 taiwan semiconductor 1a, 50v - 1000v glass passivated hi g h efficient brid g e rectifiers features moisture sensitivity level: level 1, per j-std-020 - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec dbls mechanical data case: molded plastic body rating for fusing (t<8.3ms) 10.3 maximum average forward rectified current 1 peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load i fsm unit maximum repetitive peak reverse voltage maximum rms voltage maximum dc blocking voltage polarity: polarity as marked on the body weight: 0.36 g (approximately) maximum ratings and electrical characteristics (t a =25c unless otherwise noted) parameter symbol hdbls 101g hdbls 106g hdbls 107g hdbls 102g hdbls 103g hdbls 104g hdbls 105g a maximum instantaneous forward voltage (note 1) i f = 1 a v f v i r 5 500 a 50 1.0 storage temperature range - 55 to +150 note 1: pulse test with pw=300 s,1% duty cycle note 2: reverse recovery test conditions: i f =0.5a, i r =1.0a, i rr =0.25a maximum reverse recovery time (note 2) typical thermal resistance r jl r ja 15 40 c/w 1.3 1.7 50 75 operating junction temperature range - 55 to +150 maximum reverse current @ rated v r t j =25c t j =125c
part no. note 1: "x" defines voltage from 50v (hdbls101g) to 1000v (hdbls107g) *: optional available part no. (t a =25c unless otherwise noted) document number: ds_d1310040 version: f15 hdbls107g hdbls107ghrdg 1,500 / 13" paper reel part no. suffix packing code packing code suffix description hrd g aec-q101 qualified green compound packing code packing code suffix (*) package packing h c1 gdbls 50 / tube rd ratings and characteristics curves preferred p/n hdbls101g - hdbls107g taiwan semiconductor part no. suffix ordering information example hdbls10xg (note 1) 0 0.5 1 1.5 0 20 40 60 80 100 120 140 160 average forward current (a) ambient temperature ( c) fig.1 forward current derating curve resistive or inductive load 0 10 20 30 40 50 60 70 1 10 100 peak forward surge current (a) number of cycles at 60 hz fig. 3 maximum non-repetitive forward surge current 8.3ms single half sine wave 0.1 1 10 100 1000 0 20 40 60 80 100 120 140 instantaneous reverse current ( a) percent of rated peak reverse voltage (%) fig. 4 typical reverse characteristics tj=25 tj=125 0.1 1 10 0.4 0.6 0.8 1 1.2 1.4 1.6 instantaneous forward current (a) forward voltage (v) fig. 2 typical forward characteristics hdbls101g - hdbls104g HDBLS105G hdbls106g - hdbls107g
min max min max a 5.00 5.20 0.197 0.205 b 1.02 1.20 0.040 0.047 c 8.13 8.51 0.320 0.335 d 2.40 2.60 0.094 0.102 e 9.80 10.30 0.386 0.406 f 6.20 6.50 0.244 0.256 g 0.22 0.33 0.009 0.013 h 1.02 1.53 0.040 0.060 i 0.076 0.33 0.003 0.013 j 3.90 4.10 0.154 0.161 symbol a b c d e f p/n = specific device code g = green compound yw = date code f = factory code document number: ds_d1310040 version: f15 hdbls101g - hdbls107g taiwan semiconductor package outline dimensions dim. unit (mm) unit (inch) dbls 2.6 9.2 marking diagram suggested pad layout unit (mm) 2.3 1.3 6.9 11.5 unit (inch) 0.091 0.051 0.272 0.453 0.102 0.362 0 10 20 30 40 50 60 70 0.1 1 10 100 1000 capacitance (pf) a reverse voltage (v) fig. 5 typical junction capacitance hdbls101g - HDBLS105G hdbls106g - hdbls107g f=1.0mhz vsig=50mvp-p
creat by art assumes no responsibility or liability for any errors or inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied, to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_d1310040 version: f15 hdbls101g - hdbls107g taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
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